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Plate PEEK, Ultem, Nylon and Acetal

February 6, 2012

New Surface Activation Technology

Allows you to plate previously impossible to plate plastics like PEEK, Ultem, Nylon and Acetal without the use of chemical or mechanical etching. This process is perfect for connectors and replaces cadmium for military specification MTL-DTL-38999.


The benefits of plating on PEEK, Ultem, Nylon and Acetal over traditional plastics are:

  • More strength (glass/carbon reinforced)
  • High temperature capacity
  • Lower weight (50% less than aluminum)

SAT vs chemical or mechanical etch

The main differences are that and SAT part has the following characteristics:

  • High adhesion values
  • A smooth surface which retains the substrate profile
  • RoHS compliant

In order for the process to work an ionic palladium plating line is required which makes the number of companies with the ability to perform this process extremely rare.

However due to the importance of this process to the Military and Aerospace connector industry, SelectConnect Technologies has made the investment to upgrade our capabilities.

Take a look at the examples in the short video. Do the look like plastic parts to you?

Where could you use a strong lightweight connector? Let us know by leaving your application is the comments below.

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SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.

As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production.  Contact us to learn more about our processes and


From → 3D-MID market

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