What is a 3D MID?
A 3D MID or 3 Dimensional Molded Interconnect Device is a plastic part molded from an LDS compound. The compound contains a dopent that when activated by a laser allows the circuitry or antenna artwork to take electroless plating and become conductive. This is done via laser direct structuring, otherwise know as LDS.
Check out the video to see a great example!
3D-MID blog is brought to you by SelectConnect Technologies.
SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production. Contact us to learn more about our processes and technologies. www.selectconnecttech.com