How To Select The Proper LDS Material?
Without the proper material selection from the beginning, your LDS project could easily go from a hit to a headache. There are a number of important considerations when determining the proper base material of your LDS project. Among them are:
LDS granulate
- Thermal Expansion
- Water Absorption
- Mechanical Characteristics
- Solderability (including laser or supersonic welding)
A number of series materials or thermoplastics are available to produce injection-moulded MIDs for the LPKF-LDS method. These materials are suitable for a large number of different applications thanks to their broad spectrum of properties:
PA6/6T (semi-aromatic polyamide), based on Ultramid®
- very high thermal shape stability, suitable for reflow soldering (also with lead-free solder)
- very good mechanical properties
Thermoplastic polyester (PBT, PET and blends), based on Pocan®
- very good mechanical and electrical properties
- very high thermal shape stability with addition of PET
Crosslinked PBT (polybutylenterephathalate), based on Vestodur®
- migration-resistant fire protection equipment (VO – 0.4 mm after UL94)
- irradiation crosslinkable for high temperature resistance (all soldering processes)
LCP (Liquid Crystal Polymer), based on Vectra®
- very good flow properties
- very good dimensional stability under thermal stress
PC/ABS (polycarbonate / acrylnitrile / butadiene / styrol)*
- very good surface properties
- very good mechanical properties
Everything starts with a good understanding of your project and a discussion with an LDS expert like SelectConnect Technologies.
SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production. Contact us to learn more about our processes and technologies.www.selectconnecttech.com
3D MIDs and Peanut Butter Cups
What can we learn about 3D MIDs from Peanut Butter Cups?
A lot.
But first lets go back to our childhood and look at the infamous Reese’s Peanut Butter Cup commercial. You know the one that shows how it all started.
Two guys, each one loves their snack of choice. One chocolate, the other peanut butter. Both have no intention of ever switching to the others snack of choice.
Then one day they round a corner from opposite sides and crash.
“Your chocolates in my peanut butter!”
“Your peanut butters on my chocolate!”
Separate both chocolate and peanut butter are OK. But combined they’re awesome!
In the commercial it was serendipity. In real life Mr. Reese (a former Hershey employee) probably noticed something that many people took for granted and combine the two. In many cases creativity is just taking two ideas that already exist and combining them into something new.
What two things would you combine to make something radically different?
Hey, my circuits are on your plastic component! And it works!
Not long ago someone thought of combining circuits and plastic components. The result, 3 dimensional molded interconnects (3D MID), changed the way cell phone antennas are made today.
LDS Antenna for cell phone
Antenna are no longer planer. Reception isn’t dependent on your orientation to the tower.
You can get multiple antenna into smaller spaces because you have integrated antenna pattern and circuitry into an existing and previously unused space, the carrier.
You have eliminated parts making the entire system less complex and more reliable.
How could you use a 3D MID to make your product better?
Being creative is looking more closely to the combinations available to you. It’s about being fearless not necessarily being more intelligent.
After all there are a lot of intelligent people who aren’t overly creative. In fact some are down right boring.
Fearlessness however is almost always present in creative people. They lack the fear of others judging them and being laughed at if something doesn’t quite work. They keep trying. they know when they are onto something that could change the world.
Do you consider yourself fearless?
Can you see the benefits of 3D MID technology to your product?
Do you want to explore the combination of your product with our 3 dimensional molded interconnect technology?
If so, contact us today for a complimentary overview.
No pressure, no strings. And your IP is safe, we don’t compete with our customers, we make their product better.
If you found this information to be useful subscribe to our blog so you won’t miss any of the valuable information we provide.
SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production. Contact us to learn more about our processes and technologies.www.selectconnecttech.com
Plate PEEK, Ultem, Nylon and Acetal
New Surface Activation Technology
Allows you to plate previously impossible to plate plastics like PEEK, Ultem, Nylon and Acetal without the use of chemical or mechanical etching. This process is perfect for connectors and replaces cadmium for military specification MTL-DTL-38999.
Benefits
The benefits of plating on PEEK, Ultem, Nylon and Acetal over traditional plastics are:
- More strength (glass/carbon reinforced)
- High temperature capacity
- Lower weight (50% less than aluminum)
SAT vs chemical or mechanical etch
The main differences are that and SAT part has the following characteristics:
- High adhesion values
- A smooth surface which retains the substrate profile
- RoHS compliant
In order for the process to work an ionic palladium plating line is required which makes the number of companies with the ability to perform this process extremely rare.
However due to the importance of this process to the Military and Aerospace connector industry, SelectConnect Technologies has made the investment to upgrade our capabilities.
Take a look at the examples in the short video. Do the look like plastic parts to you?
Where could you use a strong lightweight connector? Let us know by leaving your application is the comments below.
If you found this information to be useful subscribe to our blog so you won’t miss any of the valuable information we provide.
SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production. Contact us to learn more about our processes and technologies.www.selectconnecttech.com
The 4 R’s of Selective Metallization of Plastic
When you selectively metallize circuitry on plastic, you create what is called a 3 Dimensional Molded Interconnect Device or 3D MID. There are several methods of creating 3D MID’s however the benefits can be seen across technologies. The two main technologies are Laser Direct Structuring (LDS) and the metallization of a double-shot molded component.
The 4 R’s of Selective Metallization of Plastics are:
Reduce Weight
Today’s plastics are strong enough to replace aluminum in many applications and plastics weigh half as much. Add to that the elimination of a pcb when you structure your circuitry directly onto the plastic part and your weight savings are substantial.
Reduce Size
The combination of electric and mechanical systems combine with the efficient use of all the available space in the carrier allow for substantial reductions in size.
Reduce Complexity
Your circuit paths are run directly on the molded component eliminating wires and interconnects. The need for multi-layer pcb’s is also drastically reduced.
Reduce Cost
Because the electrical and mechanical systems are integrated, assembly times can be greatly reduced.
For additional information on 3D MID’s visit SelectConnect Technologies or call us at (847) 359-1490.
SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production. Contact us to learn more about our processes and technologies.www.selectconnecttech.com
How Creative Are You?
How Creative are you?
Many engineers see themselves as creative. Instead of working with paints, you work with circuits, wires and boards. You take something and make it better, faster, smaller, etc. Or you create something new, something the world has never experienced.
How do you do it?
Are you born creative?
Is it part of your being?
Or is it something we all have that can be nurtured?
As an engineer, you would agree that creativity is essential in your job. New designs require a great deal of creativity. New designs almost always create a lot of buzz.
But how do you top the last success?
I may just be in how you think about it.
Watch this video from TED and then tell us how you foster your “creative genius” by leaving a comment or just go here to explore some new design techniques.
SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production. Contact us to learn more about our processes and technologies.www.selectconnecttech.com
What’s Your Why?
Why do you do what you do?
What inspires you?
Why should I care?
Watch this video clip from Simon Sinek. In it he explains why some leaders, brands, etc attract fanatic followers and others don’t.
So sit back get some coffee and spend the next few minutes with us. Then let us know your why? You can leave it in the comments section. Let others learn from you.
At SelectConnect we believe that the electronics industry is on the verge of its greatest period of innovation ever. That’s why we provide designers and manufactures cutting edge design technologies for electronic devices.
To find out more visit us at www.selectconnecttech.com or call us at (847) 359-1490.
SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production. Contact us to learn more about our processes and technologies.www.selectconnecttech.com
What’s Your Biggest Design Challenge This Year?
I really want to know.
Do you need to make things BIGGER?
Do you need to make things LOUDER?
Probably not.
I curious to hear what you’re struggling with. Leave your biggest design challenge in the comment section.
While you’re thinking, check out this video.
Thanks.
SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production. Contact us to learn more about our processes and technologies.www.selectconnecttech.com
The Perfect Compliment to PCB
How would an LDS part work in conjunction with a pcb?
A very common misconception when looking at LDS is that one can replace a pcb.
LDS is not designed to replace a pcb, in fact it is more to compliment a pcb to bridge the gap between a circuit board, wiring harness and plastic part so you can get 3D.
It’s all about reducing parts. In the example part you have the circuit structure directly on the plastic part. The plastic part is also the mechanical holder for the battery inside and it it becomes the connector of these parts. So you can have multiple systems in one part.
Are you going to make a 32 layer big circuit board or mother board with LDS?
Probably not. It is not designed for this type of stuff. But it can definitely replace complex wiring harnesses for 
automotive parts. You can eliminate the wiring harness and put the circuit structure right on the plastic part.
You can reduce part counts and definitely reduce weight while increasing reliability.
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SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production. Contact us to learn more about our processes and technologies.www.selectconnecttech.com
Keep Your Data Secure
Security Shields
Data security is a growing industry. Intrusions are being made into data devices by putting sensors into them and getting sensitive data out. Devices like:
- Computers
- ATMs
- Point of Sale devices
It’s all about detecting intrusion and the best way to do this is to have some sort of trip wire going throughout your device.
You want to do this with plastic covers. You want to cover the device with very long and thin lines.
LDS is ideal because of the disconnect between the mechanical housing and the electrical circuitry. The two are brought together later in the process with the help of the laser.
Now that you are independent, you can have any kind of artwork and any kind of mechanical device (shape).
And therefore these very challenging patterns that you see in security shields are very easily done with LDS.
And even better they can be easily changed.
To receive updates via email register for 3D MID Blog now. While your here click the LIKE button as well. Thank You.
SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production. Contact us to learn more about our processes and technologies.www.selectconnecttech.com
Sensor Packaging
Is LDS ideally suited for Senor Packaging?
Yes!
Imagine where sensors go. The are not in the most conspicuous places. They are in hard to reach areas.
We have sensors in brake systems, optical systems, electrical and vision system. We have sensors in some really funny places. These are usually places where we don’t have a lot of room. This is why we want to use the capabilities of LDS.
We want to create a carrier to carry the sensor and connect it to the outside world. An LDS sensor package replaces the wiring harness, connectors and carrier for the sensor itself. So now you can place the senor in these other areas.
Because of LDS we have better technology and systems than we did 10 years ago.
To receive updates via email register for 3D MID Blog now. While your here click the LIKE button as well. Thank You.
SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components as well as selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes and scale up to high-volume production. Contact us to learn more about our processes and technologies.www.selectconnecttech.com
